Wenjiang Zeng, Huamao Lin, Xiaolin Zhang, Ramasamy Chockalingam, Wee Chong Heng, Sangki Hong, Narayanan Balasubramanian. Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices. International Journal of Computational Engineering Science, 4(2):323-326, 2003. [doi]
Abstract is missing.