3DIC Design: Challenges and Opportunities in System-of-Chips Integration

Ming Zhang. 3DIC Design: Challenges and Opportunities in System-of-Chips Integration. In Laleh Behjat, Stephen Yang, editors, ISPD 2022: International Symposium on Physical Design, Virtual Event, Canada, March 27 - 30, 2022. pages 81, ACM, 2022. [doi]

Abstract

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