Yabin Zhang, Paolo Emilio Bagnoli. A modeling methodology for thermal analysis of the PCB structure. Microelectronics Journal, 45(8):1033-1052, 2014. [doi]
@article{ZhangB14-11,
title = {A modeling methodology for thermal analysis of the PCB structure},
author = {Yabin Zhang and Paolo Emilio Bagnoli},
year = {2014},
doi = {10.1016/j.mejo.2014.04.042},
url = {http://dx.doi.org/10.1016/j.mejo.2014.04.042},
researchr = {https://researchr.org/publication/ZhangB14-11},
cites = {0},
citedby = {0},
journal = {Microelectronics Journal},
volume = {45},
number = {8},
pages = {1033-1052},
}