Repeated On-Chip Interconnect Analysis and Evaluation of Delay, Power, and Bandwidth Metrics under Different Design Goals

Ling Zhang, Hongyu Chen, Bo Yao, Kevin Hamilton, Chung-Kuan Cheng. Repeated On-Chip Interconnect Analysis and Evaluation of Delay, Power, and Bandwidth Metrics under Different Design Goals. In 8th International Symposium on Quality of Electronic Design (ISQED 2007), 26-28 March 2007, San Jose, CA, USA. pages 251-256, IEEE Computer Society, 2007. [doi]

Abstract

Abstract is missing.