A Stress-Relieved Method Based on Bottom Pattern Design Considering Thermal and Mechanical Behavior of DBC Substrate

Chi Zhang, Cai Chen, Yi Zhang, Yiyang Yan, Yong Kang. A Stress-Relieved Method Based on Bottom Pattern Design Considering Thermal and Mechanical Behavior of DBC Substrate. IEEE Access, 10:125735-125743, 2022. [doi]

Abstract

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