Low-stress packaging for a MEMS atmosphere pressure sensor

Mengying Zhang, Lidong Du, Zhan Zhao, Zhen Fang. Low-stress packaging for a MEMS atmosphere pressure sensor. In 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2013, Suzhou, China, April 7-10, 2013. pages 665-668, IEEE, 2013. [doi]

Abstract

Abstract is missing.