Zhenqian Zhang, Paul D. Franzon. TSV-based, modular and collision detectable face-to-back shared bus design. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-5, IEEE, 2013. [doi]
@inproceedings{ZhangF13-11,
title = {TSV-based, modular and collision detectable face-to-back shared bus design},
author = {Zhenqian Zhang and Paul D. Franzon},
year = {2013},
doi = {10.1109/3DIC.2013.6702399},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702399},
researchr = {https://researchr.org/publication/ZhangF13-11},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}