Yu Zhang, Xin Jin, Qionghai Dai. A SVR based quality metric for depth quality assessment. In IEEE International Symposium on Circuits and Systems, ISCAS 2016, Montréal, QC, Canada, May 22-25, 2016. pages 2567-2570, IEEE, 2016. [doi]
@inproceedings{ZhangJD16-0,
title = {A SVR based quality metric for depth quality assessment},
author = {Yu Zhang and Xin Jin and Qionghai Dai},
year = {2016},
doi = {10.1109/ISCAS.2016.7539117},
url = {http://dx.doi.org/10.1109/ISCAS.2016.7539117},
researchr = {https://researchr.org/publication/ZhangJD16-0},
cites = {0},
citedby = {0},
pages = {2567-2570},
booktitle = {IEEE International Symposium on Circuits and Systems, ISCAS 2016, Montréal, QC, Canada, May 22-25, 2016},
publisher = {IEEE},
isbn = {978-1-4799-5341-7},
}