Researchr is a web site for finding, collecting, sharing, and reviewing scientific publications, for researchers by researchers.
Sign up for an account to create a profile with publication list, tag and review your related work, and share bibliographies with your co-authors.
Wenjing Zhang, Wei Luo, Anmin Hu, Ming Li. Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation. Microelectronics Reliability, 52(6):1157-1164, 2012. [doi]