Wenjing Zhang, Wei Luo, Anmin Hu, Ming Li. Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation. Microelectronics Reliability, 52(6):1157-1164, 2012. [doi]
@article{ZhangLHL12,
title = {Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation},
author = {Wenjing Zhang and Wei Luo and Anmin Hu and Ming Li},
year = {2012},
doi = {10.1016/j.microrel.2011.12.024},
url = {http://dx.doi.org/10.1016/j.microrel.2011.12.024},
researchr = {https://researchr.org/publication/ZhangLHL12},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {6},
pages = {1157-1164},
}