Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor

Yunfan Zhang, Bowen Li, Hui Li, Shengnan Shen, Feng Li, Wentao Ni, Wan Cao. Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor. Sensors, 21(6):2011, 2021. [doi]

@article{ZhangLLSLNC21,
  title = {Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor},
  author = {Yunfan Zhang and Bowen Li and Hui Li and Shengnan Shen and Feng Li and Wentao Ni and Wan Cao},
  year = {2021},
  doi = {10.3390/s21062011},
  url = {https://doi.org/10.3390/s21062011},
  researchr = {https://researchr.org/publication/ZhangLLSLNC21},
  cites = {0},
  citedby = {0},
  journal = {Sensors},
  volume = {21},
  number = {6},
  pages = {2011},
}