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LEGO: Empowering Chip-Level Functionality Plug-and-Play for Next-Generation IoT Devices

Chong Zhang, Songfan Li, Yihang Song, Qianhe Meng, Minghua Chen, Yanxu Bai, Li Lu 0001, Hongzi Zhu. LEGO: Empowering Chip-Level Functionality Plug-and-Play for Next-Generation IoT Devices. In Tor M. Aamodt, Natalie D. Enright Jerger, Michael M. Swift, editors, Proceedings of the 28th ACM International Conference on Architectural Support for Programming Languages and Operating Systems, Volume 3, ASPLOS 2023, Vancouver, BC, Canada, March 25-29, 2023. pages 404-418, ACM, 2023. [doi]

Authors

Chong Zhang

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Songfan Li

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Yihang Song

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Qianhe Meng

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Minghua Chen

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Yanxu Bai

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Li Lu 0001

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Hongzi Zhu

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