LEGO: Empowering Chip-Level Functionality Plug-and-Play for Next-Generation IoT Devices

Chong Zhang, Songfan Li, Yihang Song, Qianhe Meng, Minghua Chen, Yanxu Bai, Li Lu 0001, Hongzi Zhu. LEGO: Empowering Chip-Level Functionality Plug-and-Play for Next-Generation IoT Devices. In Tor M. Aamodt, Natalie D. Enright Jerger, Michael M. Swift, editors, Proceedings of the 28th ACM International Conference on Architectural Support for Programming Languages and Operating Systems, Volume 3, ASPLOS 2023, Vancouver, BC, Canada, March 25-29, 2023. pages 404-418, ACM, 2023. [doi]

@inproceedings{ZhangLSMCB0Z23,
  title = {LEGO: Empowering Chip-Level Functionality Plug-and-Play for Next-Generation IoT Devices},
  author = {Chong Zhang and Songfan Li and Yihang Song and Qianhe Meng and Minghua Chen and Yanxu Bai and Li Lu 0001 and Hongzi Zhu},
  year = {2023},
  doi = {10.1145/3582016.3582050},
  url = {https://doi.org/10.1145/3582016.3582050},
  researchr = {https://researchr.org/publication/ZhangLSMCB0Z23},
  cites = {0},
  citedby = {0},
  pages = {404-418},
  booktitle = {Proceedings of the 28th ACM International Conference on Architectural Support for Programming Languages and Operating Systems, Volume 3, ASPLOS 2023, Vancouver, BC, Canada, March 25-29, 2023},
  editor = {Tor M. Aamodt and Natalie D. Enright Jerger and Michael M. Swift},
  publisher = {ACM},
  isbn = {978-1-4503-9918-0},
}