A new hermetic sealing method for ceramic package using nanosilver sintering technology

Hao Zhang, Yang Liu, Lingen Wang, Jiajie Fan, Xuejun Fan, Fenglian Sun, Guoqi Zhang. A new hermetic sealing method for ceramic package using nanosilver sintering technology. Microelectronics Reliability, 81:143-149, 2018. [doi]

Abstract

Abstract is missing.