Zhuanzhuan Zhang, Min Miao, Xiaolong Duan. Compact Modeling and Analysis of a Typical Inter-Chiplet Serial High Speed Link on an Active Interposer. In 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021, Zhuhai, China, November 24-26, 2021. pages 65-68, IEEE, 2021. [doi]
Abstract is missing.