Driving Flip Origami Motions with Thermal-Responsive Shape Memory Alloy

Yan Zhang, Hongliang Ren. Driving Flip Origami Motions with Thermal-Responsive Shape Memory Alloy. In 2019 IEEE International Conference on Robotics and Biomimetics, ROBIO 2019, Dali, China, December 6-8, 2019. pages 1338-1343, IEEE, 2019. [doi]

@inproceedings{ZhangR19-6,
  title = {Driving Flip Origami Motions with Thermal-Responsive Shape Memory Alloy},
  author = {Yan Zhang and Hongliang Ren},
  year = {2019},
  doi = {10.1109/ROBIO49542.2019.8961539},
  url = {https://doi.org/10.1109/ROBIO49542.2019.8961539},
  researchr = {https://researchr.org/publication/ZhangR19-6},
  cites = {0},
  citedby = {0},
  pages = {1338-1343},
  booktitle = {2019 IEEE International Conference on Robotics and Biomimetics, ROBIO 2019, Dali, China, December 6-8, 2019},
  publisher = {IEEE},
  isbn = {978-1-7281-6321-5},
}