Response surface models for efficient, modular estimation of solder joint reliability in area array packages

L. Zhang, G. Subbarayan, B. C. Hunter, D. Rose. Response surface models for efficient, modular estimation of solder joint reliability in area array packages. Microelectronics Reliability, 45(3-4):623-635, 2005. [doi]

Authors

L. Zhang

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G. Subbarayan

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B. C. Hunter

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D. Rose

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