L. Zhang, G. Subbarayan, B. C. Hunter, D. Rose. Response surface models for efficient, modular estimation of solder joint reliability in area array packages. Microelectronics Reliability, 45(3-4):623-635, 2005. [doi]
@article{ZhangSHR05,
title = {Response surface models for efficient, modular estimation of solder joint reliability in area array packages},
author = {L. Zhang and G. Subbarayan and B. C. Hunter and D. Rose},
year = {2005},
doi = {10.1016/j.microrel.2004.06.007},
url = {http://dx.doi.org/10.1016/j.microrel.2004.06.007},
tags = {C++, reliability},
researchr = {https://researchr.org/publication/ZhangSHR05},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {45},
number = {3-4},
pages = {623-635},
}