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Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages

Liang Zhang, Song-bai Xue, Li-li Gao, Zhong Sheng, Sheng-lin Yu, Yan Chen, Wei Dai, Feng Ji, Zeng Guang. Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages. Microelectronics Reliability, 50(12):2071-2077, 2010. [doi]

Authors

Liang Zhang

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Song-bai Xue

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Li-li Gao

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Zhong Sheng

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Sheng-lin Yu

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Yan Chen

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Wei Dai

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Feng Ji

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Zeng Guang

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