Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages

Liang Zhang, Song-bai Xue, Li-li Gao, Zhong Sheng, Sheng-lin Yu, Yan Chen, Wei Dai, Feng Ji, Zeng Guang. Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages. Microelectronics Reliability, 50(12):2071-2077, 2010. [doi]

Abstract

Abstract is missing.