Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate

Su-Yan Zhao, Xin Li, Yun-Hui Mei, Guo-Quan Lu. Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate. Microelectronics Reliability, 55(12):2524-2531, 2015. [doi]

Abstract

Abstract is missing.