Yingbo Zhao, Yintang Yang, Gang Dong. Modeling and optimization of noise coupling in TSV-based 3D ICs. IEICE Electronic Express, 11(20):20140797, 2014. [doi]
@article{ZhaoYD14-0,
title = {Modeling and optimization of noise coupling in TSV-based 3D ICs},
author = {Yingbo Zhao and Yintang Yang and Gang Dong},
year = {2014},
doi = {10.1587/elex.11.20140797},
url = {http://dx.doi.org/10.1587/elex.11.20140797},
researchr = {https://researchr.org/publication/ZhaoYD14-0},
cites = {0},
citedby = {0},
journal = {IEICE Electronic Express},
volume = {11},
number = {20},
pages = {20140797},
}