Fang Zhong, Tao Dong, He Yong, Su Yan. Low-temperature void-free wafer-level adhesive bonding for thin film transfer by nano-imprint resist. In Tianqi Zhang, editor, 5th International Conference on BioMedical Engineering and Informatics, BMEI 2012, Chongqing, China, October 16-18, 2012. pages 757-760, IEEE, 2012. [doi]
Abstract is missing.