Yang Zhou, Zhijun Bai. Research on Thermal Coupling Modeling for Multi-chip Paralleled IGBT Modules Based on Thermal Resistance Network. In 6th IEEE International Conference on Information Systems and Computer Aided Educatio, ICISCAE 2023, Dalian, China, September 23-25, 2023. pages 407-410, IEEE, 2023. [doi]
@inproceedings{ZhouB23-6,
title = {Research on Thermal Coupling Modeling for Multi-chip Paralleled IGBT Modules Based on Thermal Resistance Network},
author = {Yang Zhou and Zhijun Bai},
year = {2023},
doi = {10.1109/ICISCAE59047.2023.10393456},
url = {https://doi.org/10.1109/ICISCAE59047.2023.10393456},
researchr = {https://researchr.org/publication/ZhouB23-6},
cites = {0},
citedby = {0},
pages = {407-410},
booktitle = {6th IEEE International Conference on Information Systems and Computer Aided Educatio, ICISCAE 2023, Dalian, China, September 23-25, 2023},
publisher = {IEEE},
isbn = {979-8-3503-1344-4},
}