Yang Zhou, Zhijun Bai. Research on Thermal Coupling Modeling for Multi-chip Paralleled IGBT Modules Based on Thermal Resistance Network. In 6th IEEE International Conference on Information Systems and Computer Aided Educatio, ICISCAE 2023, Dalian, China, September 23-25, 2023. pages 407-410, IEEE, 2023. [doi]
Abstract is missing.