Kuan Zhou, John F. McDonald. Impact of Deep-Trench-Isolation-Sharing Techniques on Ultrahigh-Speed Digital Systems. IEEE Trans. on Circuits and Systems, 56-II(10):778-782, 2009. [doi]
@article{ZhouM09-3,
title = {Impact of Deep-Trench-Isolation-Sharing Techniques on Ultrahigh-Speed Digital Systems},
author = {Kuan Zhou and John F. McDonald},
year = {2009},
doi = {10.1109/TCSII.2009.2030535},
url = {http://dx.doi.org/10.1109/TCSII.2009.2030535},
researchr = {https://researchr.org/publication/ZhouM09-3},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on Circuits and Systems},
volume = {56-II},
number = {10},
pages = {778-782},
}