A compact multi-channel receiver front-end using SiP integration technology on LTCC substrate for wireless communications

Yujin Zhou, Anfeng Sun, Jun Zhou, Ya Shen. A compact multi-channel receiver front-end using SiP integration technology on LTCC substrate for wireless communications. In International Conference on Wireless Communications & Signal Processing, WCSP 2015, Nanjing, China, October 15-17, 2015. pages 1-5, IEEE, 2015. [doi]

Abstract

Abstract is missing.