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Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing

Ze Zhu, Yan-Cheong Chan, Fengshun Wu. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing. Microelectronics Reliability, 91:179-182, 2018. [doi]

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