Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers

Liang Zhu, Biao Mei, Weidong Zhu, Wei Li. Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers. Sensors, 20(6):1603, 2020. [doi]

Authors

Liang Zhu

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Biao Mei

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Weidong Zhu

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Wei Li

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