Liang Zhu, Biao Mei, Weidong Zhu, Wei Li. Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers. Sensors, 20(6):1603, 2020. [doi]
@article{ZhuMZL20,
title = {Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers},
author = {Liang Zhu and Biao Mei and Weidong Zhu and Wei Li},
year = {2020},
doi = {10.3390/s20061603},
url = {https://doi.org/10.3390/s20061603},
researchr = {https://researchr.org/publication/ZhuMZL20},
cites = {0},
citedby = {0},
journal = {Sensors},
volume = {20},
number = {6},
pages = {1603},
}