Lingjun Zhu, Tuan Ta, Rossana Liu, Rahul Mathur, Xiaoqing Xu, Shidhartha Das, Ankit Kaul, Alejandro Rico, Doug Joseph, Brian Cline, Sung Kyu Lim. Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture. In IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2021, Boston, MA, USA, July 26-28, 2021. pages 1-6, IEEE, 2021. [doi]
@inproceedings{ZhuTLMXDKRJCL21,
title = {Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture},
author = {Lingjun Zhu and Tuan Ta and Rossana Liu and Rahul Mathur and Xiaoqing Xu and Shidhartha Das and Ankit Kaul and Alejandro Rico and Doug Joseph and Brian Cline and Sung Kyu Lim},
year = {2021},
doi = {10.1109/ISLPED52811.2021.9502481},
url = {https://doi.org/10.1109/ISLPED52811.2021.9502481},
researchr = {https://researchr.org/publication/ZhuTLMXDKRJCL21},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2021, Boston, MA, USA, July 26-28, 2021},
publisher = {IEEE},
isbn = {978-1-6654-3922-0},
}