Lingjun Zhu, Tuan Ta, Rossana Liu, Rahul Mathur, Xiaoqing Xu, Shidhartha Das, Ankit Kaul, Alejandro Rico, Doug Joseph, Brian Cline, Sung Kyu Lim. Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture. In IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2021, Boston, MA, USA, July 26-28, 2021. pages 1-6, IEEE, 2021. [doi]
Abstract is missing.