Design Challenges and Solutions for Memory Organization Using 3D-Integrated Circuit Technology (Ontwerptechnieken voor geheugenorganisaties gebaseerd op 3D TSV technologie) - researchr publication

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Marco Facchini. Design Challenges and Solutions for Memory Organization Using 3D-Integrated Circuit Technology (Ontwerptechnieken voor geheugenorganisaties gebaseerd op 3D TSV technologie). PhD thesis, Katholieke Universiteit Leuven, Belgium, 2011. [doi]

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