Oliver Aubel - researchr alias

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Viewing Publication 1 - 7 from 7

2014

Empirical BEOL-TDDB evaluation based on I(t)-trace analysisOliver Aubel, Armand Beyer, Georg Talut, Martin Gall. mr, 54(9-10):1671-1674, 2014. [doi]

Robust Electromigration reliability through engineering optimizationWee Loon Ng, Kheng Chok Tee, Junfeng Liu, Yong Chiang Ee, Oliver Aubel, Chuan Seng Tan, Kin Leong Pey. mr, 54(9-10):1666-1670, 2014. [doi]

A quantitative study of Phosphorous implantation damage on the thick gate oxide of the 28 nm nodeXinggong Wan, Sandhya Chandrashekhar, Boris Bayha, Martin Trentzsch, Torben Balzer, Mahesh Siddabathula, Oliver Aubel. mr, 54(9-10):2306-2309, 2014. [doi]

2009

Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodelingJoharsyah Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel. mr, 49(9-11):1090-1095, 2009. [doi]

2008

Simulation of migration effects in nanoscaled copper metallizationsKirsten Weide-Zaage, Farzan Kashanchi, Oliver Aubel. mr, 48(8-9):1398-1402, 2008. [doi]

Determination of migration effects in Cu-via structures with respect to process-induced stressKirsten Weide-Zaage, Jiani Zhao, Joharsyah Ciptokusumo, Oliver Aubel. mr, 48(8-9):1393-1397, 2008. [doi]

2006

Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systemsOliver Aubel, Eberhard Bugiel, Dietmar Krüger, Wolfgang Hasse, Martina Hommel. mr, 46(5-6):768-773, 2006. [doi]

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