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Kouichi Maruyama

Raymond Caramto

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Researchr

Researchr is a web site for finding, collecting, sharing, and reviewing scientific publications, for researchers by researchers.

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Publications by 'Weng Hong Teh'

Publications

Viewing Publication 1 - 2 from 2

2010

Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bondingWeng Hong Teh, C. Deeb, J. Burggraf, D. Arazi, R. Young, C. Senowitz, A. Buxbaum. 3dic 2010: 1-6 [doi]

2009

A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integrationWeng Hong Teh, Raymond Caramto, Jamal Qureshi, Sitaram Arkalgud, M. O Brien, T. Gilday, Kou Maekawa, T. Saito, Kouichi Maruyama, Thenappan Chidambaram, Wei Wang, David Marx, D. Grant, Russ Dudley. 3dic 2009: 1-5 [doi]

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