| 10 | -- | 12 | P. R. Mukund, J. F. McDonald. MCM: The High-Performance Electronic Packaging Technology |
| 13 | -- | 21 | Robert K. Scannell, John K. Hagge. Development of a Multichip Module DSP |
| 23 | -- | 29 | Wolfgang Daum, William E. Burdick Jr., Raymond A. Fillion. Overlay High-Density Interconnect: A Chips-First Multichip Module Technology |
| 30 | -- | 39 | David P. LaPotin, Toufie R. Mazzawy, Marlin L. White. Early Package Analysis: Considerations and Case Study |
| 41 | -- | 49 | Paul D. Franzon, Robert J. Evans. A Multichip Module Design Process for Notebook Computers |
| 50 | -- | 61 | Claus M. Habiger, R. Mike Lea. Hybrid-WSI: A Massively Parallel Computing Technology? |
| 62 | -- | 74 | Ranga Vemuri, Nand Kumar, Raghu Vutukuru, Prasad Subba Rao, Praveen Sinha, Ning Ren, Paddy Mamtora, Ram Mandayam, Ram Vemuri, Jayanta Roy. An Integrated Multicomponent Synthesis for MCMs |
| 76 | -- | 81 | Peyman H. Dehkordi, Donald W. Bouldin. Design for Packageability: Early Consideration of Packaging from a VLSI Designer s Viewpoint |
| 82 | -- | 86 | Lance A. Glasser. A Road Map to ARPA Involvement in Electronic Packaging |