| 1 | -- | 2 | . Editor s Note |
| 3 | -- | 18 | Phillipe M. Vereecken, Robert A. Binstead, Hariklia Deligianni, Panayotis C. Andricacos. The chemistry of additives in damascene copper plating |
| 19 | -- | 36 | Thomas P. Moffat, Daniel Wheeler, Monica D. Edelstein, Daniel Josell. Superconformal film growth: Mechanism and quantification |
| 37 | -- | 48 | Alan C. West, Hariklia Deligianni, Panayotis C. Andricacos. Electrochemical planarization of interconnect metallization |
| 49 | -- | 64 | Timothy O. Drews, Sriram Krishnan, Jay Alameda, Dennis Gannon, Richard D. Braatz, Richard C. Alkire. Multiscale simulations of copper electrodeposition onto a resistive substrate |
| 65 | -- | 78 | Thomas L. Ritzdorf, Gregory J. Wilson, Paul R. McHugh, Daniel J. Woodruff, Kyle M. Hanson, Dakin Fulton. Design and modeling of equipment used in electrochemical processes for microelectronics |
| 79 | -- | 102 | Li Sun, Yaowu Hao, Chia-Ling Chien, Peter C. Searson. Tuning the properties of magnetic nanowires |
| 103 | -- | 126 | Emanuel I. Cooper, Christian Bonhôte, Jürgen Heidmann, Yimin Hsu, Philippe Kern, John W. Lam, Murali Ramasubramanian, Neil Robertson, Lubomyr T. Romankiw, Hong Xu. Recent developments in high-moment electroplated materials for recording heads |
| 127 | -- | 144 | Philip G. Emma, Allan Hartstein, Thomas R. Puzak, Viji Srinivasan. Exploring the limits of prefetching |
| 145 | -- | 166 | Richard E. Matick, Stanley Schuster. Logic-based eDRAM: Origins and rationale for use |
| 167 | -- | 188 | Taqi N. Buti, Robert G. McDonald, Zakaria Khwaja, Asit Ambekar, Hung Q. Le, William E. Burky, Bert Williams. Organization and implementation of the register-renaming mapper for out-of-order IBM POWER4 processors |