| 929 | -- | 0 | Suresh V. Garimella, Amy S. Fleischer. Foreword |
| 930 | -- | 941 | Raj Yavatkar, Murli Tirumala. Platform wide innovations to overcome thermal challenges |
| 942 | -- | 949 | S. Kubota, A. Taguchi, K. Yazawa. Thermal challenges deriving from the advances of display technologies |
| 950 | -- | 956 | A. Bulusu, D. G. Walker. One-dimensional thin-film phonon transport with generation |
| 957 | -- | 965 | V. Bahadur, Suresh V. Garimella. Energy minimization-based analysis of electrowetting for microelectronics cooling applications |
| 966 | -- | 974 | H. Oprins, J. Danneels, B. Van Ham, Bart Vandevelde, M. Baelmans. Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling |
| 981 | -- | 991 | Y. Ezzahri, G. Zeng, K. Fukutani, Z. Bian, A. Shakouri. A comparison of thin film microrefrigerators based on Si/SiGe superlattice and bulk SiGe |
| 992 | -- | 1000 | Rajiv Mongia, A. Bhattacharya, Himanshu Pokharna. Skin cooling and other challenges in future mobile form factor computing devices |
| 1008 | -- | 1015 | Peter E. Raad, Pavel L. Komarov, Mihai G. Burzo. Thermal characterization of embedded electronic features by an integrated system of CCD thermography and self-adaptive numerical modeling |
| 1016 | -- | 1022 | A. Whelan, Y. Joshi, W. King. Improved compact thermal model for studying 3-D interconnect structures with low-k dielectrics |
| 1023 | -- | 1029 | Sara McAllister, Van P. Carey, Amip Shah, Cullen Bash, Chandrakant D. Patel. Strategies for effective use of exergy-based modeling of data center thermal management systems |