Journal: Proceedings of the IEEE

Volume 73, Issue 9

1347 -- 1348R. Fabian Pease. The special section on advanced packaging for VLSI
1349 -- 1387Shahid U. H. Qureshi. Adaptive equalization
1388 -- 1395Avram Bar-Cohen. Bounding relations for natural convection heat transfer from vertical printed circuit boards
1396 -- 1404Mali Mahalingam. Thermal management in semiconductor device packaging
1405 -- 1415George A. Katopis. Delta-I noise specification for a high-performance computing machine
1416 -- 1423J. L. Prince, Douglas J. Hamilton, Eileen M. Matz, Zbigniew J. Staszak. The role of universities in electronic packaging engineering
1426 -- 1428Katherine Siakavara, John N. Sahalos. A hybrid MM-GTD technique for the optimization of the power gain of arrays of wire antennas near an elliptic cylinder
1428 -- 1429Richard Lundin. A handbook formula for the inductance of a single-layer circular coil
1429 -- 1432Ali M. Rushdi, Paul E. Gray. Comments on "Reference node r model"
1433 -- 1434Ehud Weinstein, Anthony J. Weiss. Lower bounds on the mean square estimation error
1435 -- 0Morris Katzman. Optical communication systems
1435 -- 1436Ernest L. Walker. Pulse code formats for fiber optical data communication: Principles and applications
1436 -- 1437Philip H. Alexander. Engineers and electrons: A century of electrical progress
1436 -- 0Gordon W. Flemming. The complete handbook of personal computer communications