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Journal: Proceedings of the IEEE
Home
Index
Info
Issue
Volume
73
, Issue
9
1347
--
1348
R. Fabian Pease
.
The special section on advanced packaging for VLSI
1349
--
1387
Shahid U. H. Qureshi
.
Adaptive equalization
1388
--
1395
Avram Bar-Cohen
.
Bounding relations for natural convection heat transfer from vertical printed circuit boards
1396
--
1404
Mali Mahalingam
.
Thermal management in semiconductor device packaging
1405
--
1415
George A. Katopis
.
Delta-I noise specification for a high-performance computing machine
1416
--
1423
J. L. Prince
,
Douglas J. Hamilton
,
Eileen M. Matz
,
Zbigniew J. Staszak
.
The role of universities in electronic packaging engineering
1426
--
1428
Katherine Siakavara
,
John N. Sahalos
.
A hybrid MM-GTD technique for the optimization of the power gain of arrays of wire antennas near an elliptic cylinder
1428
--
1429
Richard Lundin
.
A handbook formula for the inductance of a single-layer circular coil
1429
--
1432
Ali M. Rushdi
,
Paul E. Gray
.
Comments on "Reference node r model"
1433
--
1434
Ehud Weinstein
,
Anthony J. Weiss
.
Lower bounds on the mean square estimation error
1435
--
0
Morris Katzman
.
Optical communication systems
1435
--
1436
Ernest L. Walker
.
Pulse code formats for fiber optical data communication: Principles and applications
1436
--
1437
Philip H. Alexander
.
Engineers and electrons: A century of electrical progress
1436
--
0
Gordon W. Flemming
.
The complete handbook of personal computer communications