Journal: Proceedings of the IEEE

Volume 89, Issue 5

583 -- 585José E. Schutt-Ainé, Sung-Mo Kang. Scanning the issue interconnections - addressing the next challenge of IC technology (part II: design, characterization, and modeling)
586 -- 601Robert H. Havemann, James A. Hutchby. High-performance interconnects: an integration overview
602 -- 633Kaustav Banerjee, Shukri J. Souri, Pawan Kapur, Krishna C. Saraswat. 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration
634 -- 664Dennis Sylvester, Chenming Wu. Analytical modeling and characterization of deep-submicrometer interconnect
665 -- 692Eby G. Friedman. Clock distribution networks in synchronous digital integrated circuits
693 -- 728Ramachandra Achar, Michel S. Nakhla. Simulation of high-speed interconnects
729 -- 739William H. Kao, Chi-Yuan Lo, Mark Basel, Raminderpal Singh. Parasitic extraction: current state of the art and future trends
740 -- 771Albert E. Ruehli, Andreas C. Cangellaris. Progress in the methodologies for the electrical modeling of interconnects and electronic packages
772 -- 788Qingjian Yu, Ernest S. Kuh. Moment computation of lumped and distributed coupled RC trees with application to delay and crosstalk estimation
789 -- 0Thomas J. Shaffner. Correction to "semiconductor characterization and analytical technology"
790 -- 792Brian Bowers. Scanning our past from London: Galileo Ferraris and alternating current