Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs

Siting Liu 0002, Jiaxi Jiang, Zhuolun He, Ziyi Wang, Yibo Lin, Bei Yu 0001, Martin D. F. Wong. Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs. In Iris Hui-Ru Jiang, Gracieli Posser, editors, Proceedings of the 2024 International Symposium on Physical Design, ISPD 2024, Taipei, Taiwan, March 12-15, 2024. pages 75-82, ACM, 2024. [doi]

Abstract

Abstract is missing.