A Novel Approach for Assessing Impact of Temperature Hot-Spots on Chip-Package Interaction Reliability - researchr publication authors

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R. Aggarwal, L. Jiang, S. Patra, N. Lajo, E. Kabir, R. Kasim. A Novel Approach for Assessing Impact of Temperature Hot-Spots on Chip-Package Interaction Reliability. In IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022. pages 4, IEEE, 2022. [doi]

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