R. Aggarwal, L. Jiang, S. Patra, N. Lajo, E. Kabir, R. Kasim. A Novel Approach for Assessing Impact of Temperature Hot-Spots on Chip-Package Interaction Reliability. In IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022. pages 4, IEEE, 2022. [doi]
@inproceedings{AggarwalJPLKK22,
title = {A Novel Approach for Assessing Impact of Temperature Hot-Spots on Chip-Package Interaction Reliability},
author = {R. Aggarwal and L. Jiang and S. Patra and N. Lajo and E. Kabir and R. Kasim},
year = {2022},
doi = {10.1109/IRPS48227.2022.9764409},
url = {https://doi.org/10.1109/IRPS48227.2022.9764409},
researchr = {https://researchr.org/publication/AggarwalJPLKK22},
cites = {0},
citedby = {0},
pages = {4},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022},
publisher = {IEEE},
isbn = {978-1-6654-7950-9},
}