Anthony Agnesina, Moritz Brunion, Alberto García Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim. Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs. In Hai Helen Li, Charles Augustine, Ayse Kivilcim Coskun, Swaroop Ghosh, editors, ISLPED '22: ACM/IEEE International Symposium on Low Power Electronics and Design, Boston, MA, USA, August 1 - 3, 2022. ACM, 2022. [doi]
@inproceedings{AgnesinaBOCMKCR22,
title = {Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs},
author = {Anthony Agnesina and Moritz Brunion and Alberto García Ortiz and Francky Catthoor and Dragomir Milojevic and Manu Komalan and Matheus A. Cavalcante and Samuel Riedel and Luca Benini and Sung Kyu Lim},
year = {2022},
doi = {10.1145/3531437.3539702},
url = {https://doi.org/10.1145/3531437.3539702},
researchr = {https://researchr.org/publication/AgnesinaBOCMKCR22},
cites = {0},
citedby = {0},
booktitle = {ISLPED '22: ACM/IEEE International Symposium on Low Power Electronics and Design, Boston, MA, USA, August 1 - 3, 2022},
editor = {Hai Helen Li and Charles Augustine and Ayse Kivilcim Coskun and Swaroop Ghosh},
publisher = {ACM},
isbn = {978-1-4503-9354-6},
}