Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling - researchr publication authors

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P. A. Agyakwa, M. R. Corfield, L. Yang, J. F. Li, V. M. F. Marques, C. M. Johnson. Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling. Microelectronics Reliability, 51(2):406-415, 2011. [doi]

This author has not been identified. Look up 'P. A. Agyakwa' in GoogleThis author has not been identified. Look up 'M. R. Corfield' in GoogleThis author has not been identified. It may be one of the following persons:

Lishan Yang

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