Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling

P. A. Agyakwa, M. R. Corfield, L. Yang, J. F. Li, V. M. F. Marques, C. M. Johnson. Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling. Microelectronics Reliability, 51(2):406-415, 2011. [doi]

Abstract

Abstract is missing.