P. A. Agyakwa, M. R. Corfield, L. Yang, J. F. Li, V. M. F. Marques, C. M. Johnson. Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling. Microelectronics Reliability, 51(2):406-415, 2011. [doi]
@article{AgyakwaCYLMJ11,
title = {Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling},
author = {P. A. Agyakwa and M. R. Corfield and L. Yang and J. F. Li and V. M. F. Marques and C. M. Johnson},
year = {2011},
doi = {10.1016/j.microrel.2010.08.018},
url = {http://dx.doi.org/10.1016/j.microrel.2010.08.018},
tags = {C++},
researchr = {https://researchr.org/publication/AgyakwaCYLMJ11},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {51},
number = {2},
pages = {406-415},
}