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TSV capacitance aware 3-D floorplanning

Mohammad A. Ahmed, Malgorzata Chrzanowska-Jeske. TSV capacitance aware 3-D floorplanning. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-6, IEEE, 2013. [doi]

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