Ryo Aizawa, Masahiro Sawa, Jinta Nampo, Yurina Fukumoto, Murugesan Mariappan, Takafumi Fukushima. Antioxidative Cu Electrodeposition for 3D Interconnects with Hybrid Bonding. In International 3D Systems Integration Conference, 3DIC 2024, Sendai, Japan, September 25-27, 2024. pages 1-4, IEEE, 2024. [doi]
Abstract is missing.