Table of Contents

• 3D SRAM Design & Optimization with Open Source Memory CompilerSunan Chen, Chao Wu, Yunlang Cai, Yuan Guan, Yuanqing Cheng. 1-5 [doi]
• Impact of 2-Dimensional Materials for 3D Power ICAyano Furue, Mastaka Hasegawa, Satoshi Matsumoto. 1-5 [doi]
• Direct Sputtered Copper Seed Layer Formation on Low Dielectric Resin to Reduce Transmission LossAkihiro Shimizu, Kazuhiro Fukada, Shinichi Endo, Mitsuru Abe, Akiko Matsui. 1-4 [doi]
• Gate Driver IC for GaN Power Device Suitable for 3D Power ICYusuke Ohgushi, Satoshi Matsumoto. 1-4 [doi]
• Superconducting Titanium Nitride in Through-Silicon Vias for 3D Integration of QubitsAlexandra Schewski, Ulrich Schaber, Armin Klumpp. 1-6 [doi]
• Clean Dicing: An Alternative Blade Dicing Technique for Minimising Particles in 3D Heterogeneous IntegrationAkito Hiro, Damien Jon Leech, Geert Schoofs, John Slabbekoorn, Alain Phommahaxay, Koen Kennes, Gerald Beyer, Eric Beyne. 1-5 [doi]
• Room-Temperature and Compressive Force-Free Metal-Metal Direct Bonding for Heterogeneous Integration of Micro-LED Array on 3D-ICJiayi Shen, Chang Liu, Tetsu Tanaka, Takafumi Fukushima. 1-3 [doi]
• Advanced Development of Squeeze Effect Non-Contact Handling Tool for Semiconductor ChipsHayato Hishinuma, Masaaki Miyatake, Hiroshi Kikuchi, Yuta Tobari. 1-4 [doi]
• Face-Down and Heterogeneous Chip Bonding Technology on Waffle-Wafer for Bumpless Chip-an-Wafer (COW) PackageYoshiaki Satake, Tatsuya Funaki, Wataru Doi, Hajime Kato, Shogo Okita, Takayuki Ohba. 1-3 [doi]
• Detectability of Resistive Open Defects with Analog Relaxation Oscillators Under Unit-to-Unit Variations of DiesYuya Yamahashi, Yuto Ohtera, Hiroyuki Yotsuyanagi, Shyue-Kung Lu, Masaki Hashizume. 1-5 [doi]
• Supression of TSV-Induced Stress by Using Negative Thermal Expansion MaterialHisashi Kino, Takafumi Fukushima, Tetsu Tanaka. 1-3 [doi]
• Antioxidative Cu Electrodeposition for 3D Interconnects with Hybrid BondingRyo Aizawa, Masahiro Sawa, Jinta Nampo, Yurina Fukumoto, Murugesan Mariappan, Takafumi Fukushima. 1-4 [doi]
• Electrochemical Deposition of Indium for Scalable 3D Quantum ChipletsJowesh Avisheik Goundar, La Thi Ngoc Mai, Moris Yuki, Otake Yugi, Hideo Kosaka, Fumihiro Inoue. 1-4 [doi]
• A Novel Multi-Chip Cooling System Using Direct-on-Chip Jet Impingemnt for High-Performance Interposer PackageAkshat Hetal Patel, Ketan Yogi, Gopinath Sahu, Tiwei Wei. 1-6 [doi]
• Surface Modification for Ultrasonic Cu-to-Cu Direct BondingChih-Hsien Chiu, Wei-Ting Chen, Jenn-Ming Song. 1-4 [doi]
• Cost-Effective Low-Temperature Hybrid Bonding Using Layer Transfer TechnologyYu-Lun Liu, Chun-Ta Li, Tzu-Han Sun, Chien-Kang Hsiung, Yuan-Chiu Huang, Kuan-Neng Chen. 1-4 [doi]
• Die-to-Wafer Hybrid Bonding Impact at MM-Wave FrequenciesMohammad Alsukour, Olivier Valorge, Margot Faure, Loïc Vincent, Victor Milon, Pascal Chevalier 0002, Emmanuel Pistono, Jean-Daniel Arnould, Christophe Dubarry. 1-6 [doi]
• Thermal Flow Simuation and Measurements of 3D Si Chip Stacks with TSVsShuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaaki Okidono, Takuji Miki, Makoto Nagata. 1-3 [doi]
• Towards 3D AI Hardware: Fine-Grain Hardware Characterization of 3D Stacks for Heterogeneous System Integration & AI SystemsEren Kurshan, Paul D. Franzon. 1-6 [doi]
• Impact of Cu Pad Density on Cu-CMP and Bonding Yield for Chip-to-Wafer Hybrid BondingMariappan Murugesan, Hiroyuki Hashimoto, Kentaro Mihara, Takashi Hare, Takafumi Fukushima, Fumihiro Inoue, Akira Uedono. 1-5 [doi]
• Low-Temperature Adhesive Hybrid Bonding Technology with Novel Area-Selective Passivation LayerTzu-Han Sun, Yu-Lun Liu, Chun-Ta Li, Wen-Tzu Tsai, Mu-Ping Hsu, Kuan-Neng Chen. 1-4 [doi]
• Thermal Analysis of Reflow Process for PIC-Embedded Package Substrate with 2.3D RDL Interposer for Co-Packaged OpticsAkihiro Noriki, Hirotaka Uemura, Haruhiko Kuwatsuka, Naoki Matsui, Reona Motoji, Dan Maeda, Tomoya Sugita, Fumi Nakamura, Takeru Amano. 1-3 [doi]
• A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy peeling and Excellent TTV for 3DICMoeki Nakano, Shigenori Nagahama, Toshio Takahashi, Takuya Yamamoto. 1-3 [doi]
• Ultra-High Density Deep Trench Capacitor (DTC) for 3DIC IntegrationH.-L. Cheng, J. Y. Lin, T.-C. Hsu, Eva Su, S. M. Wu, Y. C. Chang, T. H. Chien, C. Y. Peng, J. H. Yang, Felix Tsui, S. F. Huang. 1-3 [doi]
• 3D Stacked Spin Qubit by TCAD SimulationsTetsufumi Tanamoto. 1-4 [doi]
• Temporary Adhesive Effect on Multichip Thinning for Rapid Prototyping of 3D-IC from 2D-IC Fabricated in Foundry Shuttle ServicesAkihiro Tominaga, Jiayi Shen, Chang Liu, Atsushi Shinoda, Tetsu Tanaka, Takafumi Fukushima. 1-3 [doi]
• Activation of Copper Surfaces by VUV - Redox Method Using a Xenon Excimer LampShinichi Endo, Akihiro Shimizu. 1-3 [doi]
• Process Development for a Novel Low Loss and Non-PFAS Photo Imageable Dielectric for RF Silicon Interposer ApplicationsHamideh Jafarpoorchekab, Xiao Sun, Angel Uruena, Siddhartha Sinha, Nelson Pinho, Andy Miller, Nadine Collaert. 1-6 [doi]
• Plasma Hydrophilic Treatment for Improved Wafer Bonding Strength via PolysilazaneDaiki Nemoto, Kai Takeuchi, Eiji Higurashi. 1-3 [doi]
• 16-Layer 3D Stacking Based on Self-Assembly Technology for HBM ApplicationDu Zehua, Hiroshi Kikuchi, Hayato Hishinuma, Tetsu Tanaka, Takafumi Fukushima. 1-3 [doi]
• A Novel Direct Transfer Bonding Process with Particle Less Tapes for Die to Wafer IntegrationTomoka Kirihata, Masanori Yamagishi, Ichiro Sano, Haruka Morita, Yusuke Fumita, Shinya Takyu. 1-5 [doi]
• Characterization of Ozone-Ethylene Radical Pretreatment for Hybrid Bonding without Water Rinsing ProcessesBungo Tanaka, Tatsunori Shino, Murugesan Mariappan, Tetsu Tanaka, Takafumi Fukushima. 1-4 [doi]
• TSV Formation Using a Direct CU Electroplating on Electroless Plated Barrier Layer with a Low ResistivityYuko Ishii, Takanobu Hamamura, Tomohiro Shimizu, Takeshi Ito, Shoso Shingubara. 1-3 [doi]
• Creep Behavior of Low-Temperature Sn-In Solder Using Nanoindentation TestShunya Nitta, Hiroaki Tatsumi, Hiroshi Nishikawa. 1-3 [doi]
• Machine Learning-Based Diagnosis of Defects in Chiplet InterconnectsJunming Li, Huaguo Liang, Xianrui Dou, Le Yu, Zhengfeng Huang, Yingchun Lu, Cuiyun Jiang. 1-6 [doi]